Archive for March, 2011

You’ve all heard that on the highway speed kills

You’ve all heard that on the highway speed kills. When you drive too fast you put yourself at greater risks of both being in an accident and suffering grave results if that accident happens. And yet, most people speed.

Our world seems to thrive on speed: from microwave meals to sound bites to three-day diets to overnight vacations.

We drink Red Bull or espresso, watch TV on our DVRs, and talk on our cell phones while we are doing everything – all in the name of getting a little more done, in a little less time.

And in our businesses and organizations we want more results in less time, trying constantly to find a way to squeeze a bit more productivity out of each day.

This isn’t an article suggesting we move back to the “good ol’ days,” or even a case for slowing everything down.

I want rapid results too. I want to find ways to increase productivity and get more done as much as the next person.

The point of this article may seem counter-intuitive to you because in many cases, you can get better results faster, when you aren’t in such a hurry.

As you search individually and collectively for quicker implementation and results, you will serve yourself best knowing when to push down the accelerator and when to let the engine coast – or maybe even apply the brakes.

Here are five times when you might want to rest your right foot just a little:

Speed kills creativity. For most people, creativity isn’t like a light switch. So, it’s tough when you call a meeting and ask people to share their creative ideas to a problem “right now”. Have you ever spent a day or two thinking about a situation – and voila – an idea comes to you in the shower, while you’re exercising, getting out or bed or driving your car? You maximize creativity when you allow your subconscious mind to help – and you must allow time for that to happen.

Speed kills problem solving. Teams often meet to solve a problem and, in the interest of efficiency, they move quickly to solution, typically assuming the problem is clear. And yet often the effort ends up addressing a symptom of the problem, not the problem itself. More time spent clarifying the problem, and gathering the facts about it, before getting to solution will lead to better results, even if the beginning of the process may seem slower.

Speed kills planning. Most people prefer activity to thinking. And most confuse “activity” with “accomplishment.” More planning is short changed, or not done at all, in the name of speed than for any other reason. If your objective is important enough or your project is complex enough, you will always benefit from time spent in planning – even if it feels like you are going too slow in the beginning.

Speed kills change efforts. Speed brings momentum, and momentum is definitely important to change efforts, but speed gets in the way when you assume everyone is on board, everyone knows what the change is and why you are doing it and more. Not everyone will get on board at the same time. Not everyone understands. Slow down. Communicate more. Answer questions. Recognize that some people need more time than others. Do these things and you will improve the results of your change efforts.

Speed kills dialogue. If you want to develop meaningful communication with others, it won’t happen in the first meeting. And when it does start to develop, time and space are necessary for the deep communication and understanding that dialogue can create. There is a place for a text message or a quick email. But creating deep communication and meaning won’t be created with those technologies alone. Dialogue takes time.

Notice the similarity in all of these instances? It isn’t that speed itself kills; it’s that speed at the wrong time can cause major problems. The key is timing, and remembering that many times you must go slower to go faster in the end.

The reality is that there’s a difference between speed and rushing; between a sense of urgency and hurrying. As a leader and as an individual you must be vigilant to the differences, making sure you are patient enough to use speed wisely.

Potential Pointer: Most people think of speed as a positive thing – something that’s often coveted and desired. Even in our 24/7 world where speed is king and rapid results are revered, there is a place for balance, and a need to recognize that paradoxically speed doesn’t always get you to your destination in the most effective (or even the fastest) way.

This article discusses how the generalist ceo will give way to specialist ceos in the companies of the future

This article discusses how the generalist CEO will give way to specialist CEOs in the companies of the future. As the perfect CEO, who is good at everything, will be a rare entity, companies should instead look for CEOs with deep expertise in one or two areas with enough knowledge to build a high performing supporting team. The author has described five specialist CEO types. The Brain will be a CEO who is an expert engineer, innovator, and can help lead R&D teams. The Ambassador will be a well-traveled CEO, having made visits to the leading and developing economies of the world. The Dealmaker will be an expert in mergers and acquisitions. The Conductor will be required to increase collaboration between corporate units and to help promote teamwork. The Casting Agent will be a CEO who can employ, retain and deploy the best people in the company, in short – assemble an all star team.

Future companies may have more than one CEO – each a specialist in his/her field. In the studies of leadership, the big five personality framework – extroversion, agreeableness, conscientiousness, emotional stability and openness to experience – are considered to be traits of an effective leader. Here, instead of searching for a single leader with all leadership qualities, we are searching for different leaders excelling in at least one of the qualities. If we implement this format, it will bring about changes in the studies on leadership and organizational behavior. Along with studying relationships between the CEO and his/her employees, we will also have to study the inter-personal relationships between the different CEOs of the same company handling different jobs yet working together to head the company.

An epoxy molding compound of the process selection

An epoxy molding compound of the Process Selection

1.1 Pre-processing block forming material
(1) pre-formed blocks of plastic materials are generally stored in a 5 ? -10 ? environment, will have varying degrees of moisture absorption. Therefore, before using a dry place at room temperature should be expected to wake up, generally not less than 16 hours.
(2) expected higher density of the block. Loose material block may contain too much air and moisture, through the wake up is not easy material and high-frequency warm-volatile clean, will cause an increase in the level of the device encapsulation layer. = “Semiconductors, microelectronics, integrated circuits, IC, craft, design, device, packaging, testing,
(3) The block size is expected to moderate, expected to block the small, mold filling bad; expected to block big, Kai mold problems, mold contamination and the injection rod and caused a serious waste of materials.

1.2 Die temperature of the semiconductor, microelectronics, integrated circuits, IC, craft, design, device, packaging, testing, production process, the mold temperature is controlled at slightly higher than the glass transition temperature Tg molding compounds, they can get better mobility , about 160 ? -180 ?. Mold temperature is too high, fast-curing plastic material, internal stress increased, the encapsulation layer and the framework of the adhesion decreased. At the same time, rapid curing also make Punch dissatisfaction; die temperature is too low, molding compounds poor mobility, the same will appear undesirable mold filling, the encapsulation layer mechanical strength decrease. While maintaining the mold temperature uniformity regions is very important, because non-uniform mold temperature will cause uneven curing degree of plastic material, resulting in inconsistent mechanical strength of the device

1.3 Injection pressure = “semiconductors, microelectronics, integrated circuits, IC, craft, design, device, packaging, testing, selection of injection pressure, according to the flow of plastic materials and mold temperature may be, the pressure is too small, the device encapsulation layer of low density, poor bonding with the framework, prone to moisture corrosion, and the emergence of mold is not filled with plastic material ahead of curing conditions; pressure is too large, domestic and lead impact force increases, causing distortion inside the wire has been washed or washed off, and the overflow may be expected, blocking out the vent, resulting in bubbles and fill bad.

1.4 speed injection molding
Select the speed of injection molding plastic material based mainly on the gelation time to identify. Gelation time is short, injection mold a little faster, and vice versa. Injection molding to be completed before the end of gel time, or ahead of schedule due to curing plastic material caused by thrust or encapsulated within a layer of lead defects.

1.5 Plastic Craft adjust = “semiconductors, microelectronics, integrated circuits, IC, craft, design, device, packaging, testing, appear in the actual production process as shown in Table 1 the situation, process conditions can be adjusted appropriately. To process adjustments should also be noted that the pre-molding material block storage, mold cleaning, temperature and humidity and other environmental factors on the impact of plastic Kung processes.

2 pairs of plastic material properties of the impact of device reliability
2.1 The plastic material moisture absorption and chemical adhesion to the plastic device, the moisture penetration that influence their airtight lead to failure of the important reasons. Moisture infiltration devices are mainly two ways to
(1) through encapsulation layer of plastic material body;
(2) through encapsulation layer of plastic material and metal framework of the gap between. When the moisture through this two ways when you reach the surface of the chip in its surface layer of conductive water film, and plastic compound of the Na +, CL-ions also will be brought in as a potential difference, the speed of chip surface, the electrochemical corrosion of aluminum wiring, eventually leading to open circuit lead. With the continuous improvement of integrated circuits, aluminum wiring become ever smaller and, therefore, corrosion of the aluminum wiring devices more serious impact on life expectancy.

In response to these problems, we must ask: = “semiconductors, microelectronics, integrated circuits, IC, craft, design, device, packaging, testing,
(1) plastic materials have a high purity, Na +, CL-ion to a minimum
(2) The main component of plastic material environmental standard epoxy resin and inorganic fillers of the binding force must be high, in order to prevent the infiltration of moisture from the body. , MEMS
(3) plastic material with the framework of the metal should have good adhesion;
(4) chip surface passivation layer to be improved as much as possible, its moisture is also a very good shielding effect

2.2 The internal stress of plastic materials
As the plastic material, chips, metal frame of the linear expansion coefficient mismatch arising from internal stress, the device would have a negligible impact of tightness. Because the plastic material expansion coefficient (20-26E-6 / ?) than the chip, the framework (-16E-6 / ?) the greater the cooling in the casting or in the device using the larger temperature difference between the environment, it may lead to pressure solder joint was torn off and broken wire bonding or encapsulation layer and the framework of the Department, separated from the resulting failure of their devices.

This shows that the plastic material of the linear expansion coefficient of the low as far as possible, but this reduction is received limited, because in reducing stress, while the thermal conductivity of plastic materials also will be reduced, This is packaging high-power devices very unfavorable, to make these two aspects to be taken into account, depending on the formula type and amount of filler. Filler is generally melt type or crystalline silica, in some performance needs sometimes need to add spherical silica fume or vapor.

2.3 The liquidity injection plastic materials when the mold temperature of 160 ? -180 ?, plastic was molten state, its mobility is essential to the success of the injection molding, the impact of increased liquidity below the wire (gold Tensile Strength 5g -12g), crooked or red wire easily washed off, and could easily lead to Punch discontent, the encapsulation layer of the surface folds and potholes; liquidity is too high, excess material seriously, when the overflow is expected to die prematurely out of stomatal congestion, air row entirely, the encapsulation layer of pores or air bubbles will appear.

Various components in the plastic material, the right to play a major role in mobility is a main epoxy resin melt viscosity and the amount of silica filler and particle thickness. Crystalline silica has a high thermal conductivity, but high viscosity than the heavy flow down. Fused silica has good mobility, but the poor thermal conductivity. Therefore, in the century the production of packaged device performance should be based on the use of different options, including the mix of both. 3 summarizes the choice for the packaging process, once we understand the encapsulation process of several major factors, in the packaging process can be based on different regions, different environment and climate, while the adjustment process differently. Meanwhile, officers for the package should also strengthen the understanding of epoxy molding compound.

Webster says that leadership is “the position or function of a leader; the ability to lead; an act or instance of leading, guidance, direction

Webster says that leadership is “the position or function of a leader; the ability to lead; an act or instance of leading, guidance, direction.” Do you enjoy leading, guiding or directing? Do you look forward to making decisions that impact the lives of others? Would you rather give the responsibility for making choices to someone else? Most of us have been in a position of authority and all of us have met someone who possesses the qualities of an effective leader.

Being a leader is a difficult task especially if you are given responsibilities that you are not familiar with. If you accept this position, you are going to be scrutinized by how you act, the way you look and the way you talk. It is important to be conscious of your actions because the goal is to project an image of influence. Good leaders possess certain characteristics that can help them gain the respect and recognition of others.

Be A Good Example

The first concept is to lead by example. You need to work harder than those who surround you in order to gain their respect. Demonstrate your dedication by being early and staying late. Distinguish yourself through character and integrity when situations are difficult or they are not going your way. Go the extra mile for those who are in your circle of influence.

Be A Good Listener

The second quality of an effective leader is the ability to listen more and talk less. It is more important to listen to the issues that are being raised instead of expressing your opinion about them. Some individuals have the misconception that a good leader talks as much as possible. Effective leaders realize that listening provides them with a deeper understanding of the needs of those that surround them. It also gives them a greater insight into the issues that must be addressed.

Be Concerned

The third concept for effective leadership is the ability to ask the appropriate questions. Analyzing information provides the opportunity to probe the concerns and issues that confront those around you. Express sincerity and as you examine the regards of others. Asking penetrating questions provides the possibility to discover the root causes of problems so that they can be addressed.

Be Decisive

The fourth quality of an effective leader is the ability to make decisions. Make a choice and stick to the plan. A conscientious leader will have options if the original solution is not working. With leadership comes the responsibility for making selections that affect the lives of others. If one has taken the input of those who surround them before making a decision, other considerations can be developed. It is important to examine all of the options thoroughly to avoid unnecessary mistakes and failures.

Not everyone wants to lead. If you are the owner of your home business, the head of your family or the director of a social group you are wearing the hat of a leader. Effective leadership is not necessarily an inherent quality. It can be learned and applied to the different areas of your life. Consider these four qualities as a foundation for developing your leadership skills.

“People never improve unless they look to some standard or example higher and better than themselves.”

Recent Posts